Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 031875/0278 | |
| Pages: | 4 |
| | Recorded: | 01/02/2014 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/22/2015
|
Application #:
|
14146086
|
Filing Dt:
|
01/02/2014
|
Publication #:
|
|
Pub Dt:
|
08/14/2014
| | | | |
Title:
|
SOLDER AND DIE-BONDING STRUCTURE
|
|
Assignee
|
|
|
2-1, TOYODA-CHO, KARIYA-SHI |
AICHI-KEN, JAPAN 448-8671 |
|
Correspondence name and address
|
|
GREENBLUM & BERNSTEIN, P.L.C.
|
|
1950 ROLAND CLARKE PLACE
|
|
RESTON, VA 20191
|
Search Results as of:
05/08/2024 07:24 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|