Patent Assignment Details
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| Reel/Frame: | 031889/0316 | |
| Pages: | 4 |
| | Recorded: | 01/03/2014 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/20/2015
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Application #:
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12346667
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Filing Dt:
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12/30/2008
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Publication #:
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Pub Dt:
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05/14/2009
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH THROUGH HOLE
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Assignee
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| 2-5-5, KEIHANHONDORI |
| MORIGUCHI-SHI, OSAKA, JAPAN 570-8677 |
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Correspondence name and address
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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5005 EAST MCDOWELL ROAD
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MD-A700
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PHOENIX, AZ 85008
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