Patent Assignment Details
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| Reel/Frame: | 031910/0315 | |
| Pages: | 3 |
| | Recorded: | 01/08/2014 | | |
| Attorney Dkt #: | WISP0507USA1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/03/2014
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Application #:
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14149828
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Filing Dt:
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01/08/2014
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Publication #:
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Pub Dt:
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04/24/2014
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Title:
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SOLDERING SYSTEM OF SOLDERING A DIP COMPONENT ON A CIRCUIT BOARD
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Assignee
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| 21F., NO.88, SEC. 1, HSINTAI 5TH RD., HSICHIH |
| NEW TAIPEI CITY, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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P.O.BOX 506
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MERRIFIELD, VA 22116
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