Patent Assignment Details
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| Reel/Frame: | 031913/0088 | |
| Pages: | 9 |
| | Recorded: | 01/03/2014 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ORIGINAL ASSIGNMENT STATEMENT DOCUMENT PREVIOUSLY RECORDED ON REEL 031855 FRAME 0559. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/27/2018
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Application #:
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14039938
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Filing Dt:
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09/27/2013
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Title:
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INTERPOSER SUBSTRATE DESIGNS FOR SEMICONDUCTOR PACKAGES
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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ISHIMARU & ASSOCIATES LLP
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2055 GATEWAY PLACE
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SUITE 700
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SAN JOSE, CA 95110
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