Patent Assignment Details
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| Reel/Frame: | 031920/0987 | |
| Pages: | 5 |
| | Recorded: | 01/08/2014 | | |
| Attorney Dkt #: | 200227.401 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/05/2016
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Application #:
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14150307
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Filing Dt:
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01/08/2014
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Publication #:
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Pub Dt:
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07/10/2014
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Title:
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WAFER-LEVEL PACKAGING METHOD OF BSI IMAGE SENSORS HAVING DIFFERENT CUTTING PROCESSES
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Assignee
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| 29 TINGLAN LANE |
| SUZHOU INDUSTRIAL PARK |
| SUZHOU, CHINA 215126 |
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Correspondence name and address
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TIMOTHY L. BOLLER
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701 FIFTH AVENUE
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SUITE 5400
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SEATTLE, WA 98104
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