Patent Assignment Details
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| Reel/Frame: | 032147/0179 | |
| Pages: | 21 |
| | Recorded: | 01/31/2014 | | |
| Attorney Dkt #: | MT12569TK |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF INVENTOR CHIN TECK SIONG PREVIOUSLY RECORDED ON REEL 031677 FRAME 0303. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT FROM CHIN TECK SIONG TO FREESCALE SEMICONDUCTOR, INC.. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/09/2016
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Application #:
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14090086
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Filing Dt:
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11/26/2013
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Publication #:
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Pub Dt:
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05/28/2015
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Title:
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Copper Ball Bond Interface Structure and Formation
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Assignee
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| 6501 WILLIAM CANNON DRIVE WEST |
| AUSTIN, TEXAS 78735 |
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Correspondence name and address
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TERRILE CANNATTI CHAMBERS & HOLLAND LLP
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PO BOX 203518
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AUSTIN, TX 78720
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