Patent Assignment Details
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| Reel/Frame: | 032170/0722 | |
| Pages: | 3 |
| | Recorded: | 02/07/2014 | | |
| Attorney Dkt #: | SHANG 3.9F-001 CON CIP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/22/2016
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Application #:
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14077756
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Filing Dt:
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11/12/2013
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Publication #:
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Pub Dt:
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06/05/2014
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Title:
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METHOD TO PREWET WAFER SURFACE
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Assignee
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| ROOM 210, 900 SONGZHENG ROAD |
| SHANGHAI, CHINA 201614 |
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Correspondence name and address
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LDLK&M
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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