Patent Assignment Details
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Reel/Frame: | 032179/0430 | |
| Pages: | 10 |
| | Recorded: | 02/07/2014 | | |
Attorney Dkt #: | 1012-0618 / 2013P51017US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/04/2015
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Application #:
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13964153
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Filing Dt:
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08/12/2013
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Publication #:
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Pub Dt:
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02/12/2015
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Title:
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MOLDED SEMICONDUCTOR PACKAGE WITH BACKSIDE DIE METALLIZATION
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Assignee
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AM CAMPEON 1-12 |
NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO
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8000 REGENCY PARKWAY
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SUITE 415
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CARY, NC 27518
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