Patent Assignment Details
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Reel/Frame: | 032227/0448 | |
| Pages: | 12 |
| | Recorded: | 02/17/2014 | | |
Attorney Dkt #: | TSMCP395US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/15/2016
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Application #:
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14181814
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Filing Dt:
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02/17/2014
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Publication #:
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Pub Dt:
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08/20/2015
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Title:
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WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT DEVICE MANUFACTURING PROCESSES
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Assignee
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NO. 8, LI-HSIN RD. 6 |
HSIN-CHU SCIENCE PARK |
HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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ESCHWEILER & ASSOCIATES, LLC.
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629 EUCLID AVENUE, SUITE 1000
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NATIONAL CITY BANK BUILDING
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CLEVELAND, OH 44114
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