Patent Assignment Details
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| Reel/Frame: | 032288/0806 | |
| Pages: | 4 |
| | Recorded: | 02/25/2014 | | |
| Attorney Dkt #: | B-8251 629206-1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/12/2016
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Application #:
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14188161
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Filing Dt:
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02/24/2014
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Publication #:
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Pub Dt:
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06/04/2015
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Title:
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MICRO ELECTRO MECHANICAL SYSTEMS SENSOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| 314, MAETAN 3-DONG, YEONGTONG-GU,SUWON-SI |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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Correspondence name and address
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LADAS & PARRY LLP
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5670 WILSHIRE BLVD.
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SUITE 2100
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LOS ANGELES, CA 90036
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