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Patent Assignment Details
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Reel/Frame:032324/0629   Pages: 5
Recorded: 02/28/2014
Attorney Dkt #:2004-0402A
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/07/2006
Application #:
10490629
Filing Dt:
03/25/2004
Publication #:
Pub Dt:
10/14/2004
Title:
RESIN COMPOSITION WITH HIGH THERMAL CONDUCTIVITY AND MEHOD OF PRODUCING THE SAME
Assignor
1
Exec Dt:
02/20/2014
Assignees
1
3-17, KYOMACHIBORI, 1-CHOME
NISHI-KU, OSAKA-SHI
OSAKA, JAPAN 550-0003
2
1-6-50 MORINOMIYA, JOTO-KU, OSAKA-SHI
OSAKA, JAPAN 536-8553
Correspondence name and address
WENDEROTH, LIND & PONACK, L.L.P.
1030 15TH STREET, NW
SUITE 400 EAST
WASHINGTON, DC 20005

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