Patent Assignment Details
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Reel/Frame: | 032648/0553 | |
| Pages: | 10 |
| | Recorded: | 04/10/2014 | | |
Attorney Dkt #: | 15115/672001 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/15/2015
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Application #:
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14344274
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Filing Dt:
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03/11/2014
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Publication #:
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Pub Dt:
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11/20/2014
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Title:
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METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
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Assignee
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801, MINAMIFUDODO-CHO, HORIKAWAHIGASHIIRU |
SHIOKOJI-DORI, SHIMOGYO-KU; KYOTO-SHI |
KYOTO, JAPAN 600-8530 |
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Correspondence name and address
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THOMAS K. SCHERER
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909 FANNIN ST.
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SUITE 3500
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HOUSTON, TX 77010
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