Patent Assignment Details
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| Reel/Frame: | 032656/0705 | |
| Pages: | 6 |
| | Recorded: | 04/11/2014 | | |
| Attorney Dkt #: | TIPI 3.9-691 C CON (E) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/28/2016
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Application #:
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14244007
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Filing Dt:
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04/03/2014
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Publication #:
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Pub Dt:
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11/06/2014
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Title:
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MICROELECTRONIC ASSEMBLY INCLUDING MEMORY PACKAGES CONNECTED TO CIRCUIT PANEL, THE MEMORY PACKAGES HAVING STUB MINIMIZATION FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS
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Assignee
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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Correspondence name and address
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LDLK&M
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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