Patent Assignment Details
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| Reel/Frame: | 032677/0367 | |
| Pages: | 4 |
| | Recorded: | 04/15/2014 | | |
| Attorney Dkt #: | OGOSH292USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/31/2020
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Application #:
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14351935
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Filing Dt:
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04/15/2014
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Publication #:
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Pub Dt:
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08/28/2014
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Title:
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Method of Bonding Semiconductor Elements and Junction Structure
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Assignee
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| 3-1, KASUMIGASEKI, 1 CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8921 |
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Correspondence name and address
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WILLIAM BAK, HOWSON & HOWSON LLP
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SUITE 210
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650 SENTRY PARKWAY
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BLUE BELL, PA 19422
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