Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 032824/0912 | |
| Pages: | 2 |
| | Recorded: | 05/05/2014 | | |
| Attorney Dkt #: | US100091 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
14253484
|
Filing Dt:
|
04/15/2014
|
|
Publication #:
|
|
Pub Dt:
|
04/09/2015
| | | | |
|
Title:
|
TSV Wafer Thinning Controlling Method and System
|
|
|
Assignee
|
|
|
|
|
| BLDG.D1, CHINA SR. NETWORK INT. INNOVATION PARK |
| NO.200 LINGHU BLVD. |
| WUXI CITY, JIANGSU PROVINCE, CHINA 214135 |
|
|
Correspondence name and address
|
| |
JANE ZHANG
|
| |
111 N. MARKET STREET
|
| |
SUITE 1020
|
| |
SAN JOSE, CA 95113
|
Search Results as of:
04/29/2024 10:06 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
