Patent Assignment Details
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| Reel/Frame: | 032831/0853 | |
| Pages: | 2 |
| | Recorded: | 05/06/2014 | | |
| Attorney Dkt #: | 110154A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/20/2017
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Application #:
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14269840
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Filing Dt:
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05/05/2014
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Publication #:
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Pub Dt:
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08/28/2014
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Title:
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SEMICONDUCTOR WAFER AND ITS MANUFACTURE METHOD, AND SEMICONDUCTOR CHIP
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Assignee
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| 2-10-23 SHIN-YOKOHAMA, KOHOKU-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 222-0033 |
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Correspondence name and address
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WESTERMAN, HATTORI, DANIELS & ADRIAN, LL
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1250 CONNECTICUT AVENUE, NW
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SUITE-700
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WASHINGTON, DC 20036-2657
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