Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 032834/0430 | |
| Pages: | 6 |
| | Recorded: | 05/06/2014 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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05/06/2014
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Application #:
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13007356
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Filing Dt:
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01/14/2011
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Publication #:
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Pub Dt:
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05/12/2011
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE AND PROCESS OF MANUFACTURE
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Patent #:
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Issue Dt:
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03/17/2015
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Application #:
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14271168
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Filing Dt:
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05/06/2014
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Publication #:
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Pub Dt:
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08/28/2014
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE AND PROCESS OF MANUFACTURE
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Assignee
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| CANNON'S COURT 22, VICTORIA STREET |
| HAMILTON, BERMUDA HM12 |
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Correspondence name and address
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JOSHUA D. ISENBERG
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JDI PATENT
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809 CORPORATE WAY
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FREMONT, CA 94539
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