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Patent Assignment Details

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Reel/Frame:	032880/0089			Pages:	5
		Recorded:	05/13/2014
Attorney Dkt #:	433774
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 14

Patent #:	7804693	Issue Dt:	09/28/2010	Application #:	11167858	Filing Dt:	06/27/2005
Publication #:	US20060016619	Pub Dt:	01/26/2006
Title:	PRINTED CIRCUIT BOARD HAVING STRUCTURE FOR RELIEVING STRESS CONCENTRATION, AND SEMICONDUCTOR CHIP PACKAGE EQUIPPED WITH THE SAME

Patent #:	7285845	Issue Dt:	10/23/2007	Application #:	11194285	Filing Dt:	08/01/2005
Publication #:	US20060231931	Pub Dt:	10/19/2006
Title:	LEAD FRAME FOR SEMICONDUCTOR PACKAGE

Patent #:	7470461	Issue Dt:	12/30/2008	Application #:	11244649	Filing Dt:	10/05/2005
Publication #:	US20060105153	Pub Dt:	05/18/2006
Title:	PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Patent #:	7750456	Issue Dt:	07/06/2010	Application #:	11651670	Filing Dt:	01/10/2007
Publication #:	US20070160817	Pub Dt:	07/12/2007
Title:	PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

Patent #:	7815481	Issue Dt:	10/19/2010	Application #:	11706706	Filing Dt:	02/13/2007
Publication #:	US20070200500	Pub Dt:	08/30/2007
Title:	PLASMA DISPLAY PANEL, METHOD OF MANUFACTURING ELECTRODE BURYING DIELECTRIC WALL OF DISPLAY PANEL AND METHOD OF MANUFACTURING ELECTRODE BURYING DIELECTRIC WALL OF THE PLASMA DISPLAY PANEL

Patent #:	8227173	Issue Dt:	07/24/2012	Application #:	12156513	Filing Dt:	06/02/2008
Publication #:	US20090098478	Pub Dt:	04/16/2009
Title:	METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD

Patent #:	7952175	Issue Dt:	05/31/2011	Application #:	12217195	Filing Dt:	07/02/2008
Publication #:	US20090014854	Pub Dt:	01/15/2009
Title:	LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE LEAD FRAME AND METHOD OF FORMING THE LEAD FRAME

Patent #:	8122599	Issue Dt:	02/28/2012	Application #:	12288740	Filing Dt:	10/23/2008
Publication #:	US20090107699	Pub Dt:	04/30/2009
Title:	A METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD (PCB)

Patent #:	8128752	Issue Dt:	03/06/2012	Application #:	12317562	Filing Dt:	12/23/2008
Publication #:	US20090159210	Pub Dt:	06/25/2009
Title:	ROLL-TO-ROLL SUBSTRATE TRANSFER APPARATUS, WET ETCHING APPARATUS COMPRISING THE SAME AND APPARATUS FOR MANUFACTURING PRINTED CIRCUIT BOARD

Patent #:	7811626	Issue Dt:	10/12/2010	Application #:	12328077	Filing Dt:	12/04/2008
Publication #:	US20090087547	Pub Dt:	04/02/2009
Title:	PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Patent #:	8278564	Issue Dt:	10/02/2012	Application #:	12432898	Filing Dt:	04/30/2009
Publication #:	US20090283316	Pub Dt:	11/19/2009
Title:	CIRCUIT BOARD VIAHOLES AND METHOD OF MANUFACTURING THE SAME

Patent #:	8409726	Issue Dt:	04/02/2013	Application #:	12475764	Filing Dt:	06/01/2009
Publication #:	US20100116528	Pub Dt:	05/13/2010
Title:	PRINTED CIRCUIT BOARD WITH MULTIPLE METALLIC LAYERS AND METHOD OF MANUFACTURING THE SAME

Patent #:	8431029	Issue Dt:	04/30/2013	Application #:	12492382	Filing Dt:	06/26/2009
Publication #:	US20100000776	Pub Dt:	01/07/2010
Title:	CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Patent #:	NONE	Issue Dt:		Application #:	13542233	Filing Dt:	07/05/2012
Publication #:	US20120279775	Pub Dt:	11/08/2012
Title:	CIRCUIT BOARD VIAHOLES AND METHOD OF MANUFACTURING THE SAME

Assignor

Exec Dt:

04/30/2014

Assignee

84, JEONGDONG-RO, SEONGSAN-GU

CHANGWON-SI, GYEONGSANGNAM-DO, KOREA, REPUBLIC OF 641-120

Correspondence name and address
	BRIAN C. RUPP, DRINKER BIDDLE & REATH
	191 N. WACKER DRIVE
	SUITE 3700
	CHICAGO, IL 60606-1698

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