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Total properties:
18
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Patent #:
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Issue Dt:
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01/11/2011
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Application #:
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10482092
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Filing Dt:
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12/19/2003
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Publication #:
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Pub Dt:
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07/07/2005
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Title:
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METAL PLATING METHOD AND PRETREATMENT AGENT
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Patent #:
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Issue Dt:
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08/17/2010
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Application #:
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10531645
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Filing Dt:
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04/15/2005
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Publication #:
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Pub Dt:
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07/27/2006
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Title:
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COPPER ELECTROLYTIC SOLUTION AND ELECTROLYTIC COPPER FOIL PRODUCED THEREWITH
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Patent #:
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Issue Dt:
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05/22/2012
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Application #:
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10558172
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Filing Dt:
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11/22/2005
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Publication #:
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Pub Dt:
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10/19/2006
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Title:
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METHOD FOR ELECTROLESS PLATING AND METAL-PLATED ARTICLE
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Patent #:
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Issue Dt:
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03/26/2013
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Application #:
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10576231
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Filing Dt:
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04/14/2006
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Publication #:
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Pub Dt:
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02/22/2007
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Title:
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ELECTROLESS COPPER PLATING SOLUTION
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Patent #:
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Issue Dt:
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11/02/2010
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Application #:
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10588686
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Filing Dt:
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08/07/2006
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Publication #:
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Pub Dt:
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07/26/2007
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Title:
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COPPER ELECTROLYTIC SOLUTION CONTAINING AS ADDITIVE COMPOUND HAVING SPECIFIC SKELETON, AND ELECTROLYTIC COPPER FOIL MANUFACTURED THEREWITH
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Patent #:
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Issue Dt:
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08/10/2010
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Application #:
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11586906
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Filing Dt:
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10/26/2006
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Publication #:
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Pub Dt:
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02/22/2007
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Title:
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COPPER ELECTROLYTIC SOLUTION CONTAINING QUATERNARY AMINE COMPOUND WITH SPECIFIC SKELETON AND ORGANO-SULFUR COMPOUND AS ADDITIVES, AND ELECTROLYTIC COPPER FOIL MANUFACTURED USING THE SAME
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Patent #:
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Issue Dt:
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10/25/2011
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Application #:
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11795355
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Filing Dt:
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07/13/2007
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Publication #:
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Pub Dt:
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06/12/2008
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Title:
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RESIN SUBSTRATE MATERIAL, ELECTRONIC COMPONENT SUBSTRATE MATERIAL MANUFACTURED BY ELECTROLESS PLATING ON THE SAME, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT SUBSTRATE MATERIAL
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Patent #:
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Issue Dt:
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05/28/2013
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Application #:
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11906663
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Filing Dt:
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10/03/2007
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Publication #:
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Pub Dt:
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03/27/2008
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Title:
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Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same
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Patent #:
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Issue Dt:
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05/22/2012
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Application #:
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11920021
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Filing Dt:
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11/05/2007
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Publication #:
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Pub Dt:
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03/12/2009
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Title:
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ELECTROLESS NICKEL PLATING LIQUID
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Patent #:
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Issue Dt:
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10/29/2013
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Application #:
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11992209
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Filing Dt:
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03/18/2008
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Publication #:
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Pub Dt:
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04/09/2009
| | | | |
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Title:
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Two-Layer Flexible Substrate
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Patent #:
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Issue Dt:
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06/28/2011
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Application #:
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12290328
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Filing Dt:
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10/29/2008
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Publication #:
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Pub Dt:
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03/12/2009
| | | | |
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Title:
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METHOD OF SURFACE TREATMENT USING IMIDAZOLE COMPOUND
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Patent #:
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Issue Dt:
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04/24/2012
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Application #:
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12311207
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Filing Dt:
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03/20/2009
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Publication #:
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Pub Dt:
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02/18/2010
| | | | |
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Title:
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PLATED ARTICLE HAVING METAL THIN FILM FORMED BY ELECTROLESS PLATING, AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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03/12/2013
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Application #:
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12311208
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Filing Dt:
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03/20/2009
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Publication #:
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Pub Dt:
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01/07/2010
| | | | |
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Title:
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PLATED ARTICLE HAVING METAL THIN FILM FORMED BY ELECTROLESS PLATING
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Patent #:
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Issue Dt:
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08/23/2011
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Application #:
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12449128
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Filing Dt:
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07/23/2009
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Publication #:
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Pub Dt:
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01/13/2011
| | | | |
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Title:
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ELECTRONIC COMPONENT FORMED WITH BARRIER-SEED LAYER ON BASE MATERIAL
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Patent #:
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Issue Dt:
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01/03/2012
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Application #:
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12449162
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Filing Dt:
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07/23/2009
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Publication #:
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Pub Dt:
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01/13/2011
| | | | |
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Title:
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ELECTRONIC COMPONENT FORMED WITH BARRIER-SEED LAYER ON BASE MATERIAL
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|
|
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Patent #:
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|
Issue Dt:
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05/27/2014
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Application #:
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12734560
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Filing Dt:
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05/07/2010
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Publication #:
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Pub Dt:
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09/30/2010
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Title:
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SUBSTRATE AND MANUFACTURING METHOD THEREFOR
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|
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Patent #:
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Issue Dt:
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08/21/2012
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Application #:
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12734590
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Filing Dt:
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05/10/2010
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Publication #:
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Pub Dt:
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09/30/2010
| | | | |
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Title:
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SUBSTRATE AND MANUFACTURING METHOD THEREFOR
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|
|
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Patent #:
|
|
Issue Dt:
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03/05/2013
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Application #:
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12735187
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Filing Dt:
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06/18/2010
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Publication #:
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Pub Dt:
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12/16/2010
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Title:
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ULSI MICRO-INTERCONNECT MEMBER HAVING RUTHENIUM ELECTROPLATING LAYER ON BARRIER LAYER
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