Patent Assignment Details
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| Reel/Frame: | 033205/0545 | |
| Pages: | 4 |
| | Recorded: | 06/20/2014 | | |
| Attorney Dkt #: | 2014-010USORG |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/17/2015
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Application #:
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14310075
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Filing Dt:
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06/20/2014
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Title:
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BONDING PAD FOR PRINTED CIRCUIT BOARD AND SEMICONDUCTOR CHIP PACKAGE USING SAME
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Assignee
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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Correspondence name and address
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AVAGO TECHNOLOGIES, LTD.
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4380 ZIEGLER ROAD
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FORT COLLINS, CO 80525
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