Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 033293/0031 | |
| Pages: | 5 |
| | Recorded: | 07/11/2014 | | |
| Attorney Dkt #: | 048370-0229-00-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/01/2016
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Application #:
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14328765
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Filing Dt:
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07/11/2014
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Publication #:
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Pub Dt:
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01/29/2015
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Title:
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BUMP STRUCTURE, WIRING SUBSTRATE, SEMICONDUCTOR APPARATUS AND BUMP STRUCTURE MANUFACTURING METHOD
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Assignee
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| 80, OSHIMADA-MACHI |
| NAGANO-SHI, NAGANO, JAPAN 381-2287 |
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Correspondence name and address
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DRINKER BIDDLE & REATH (DC)
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1500 K STREET, N.W.
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SUITE 1100
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WASHINGTON, DC 20005-1209
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