Patent Assignment Details
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| Reel/Frame: | 033336/0705 | |
| Pages: | 9 |
| | Recorded: | 07/17/2014 | | |
| Attorney Dkt #: | 5649-3861 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/04/2016
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Application #:
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14334265
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Filing Dt:
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07/17/2014
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Publication #:
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Pub Dt:
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01/22/2015
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Title:
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TEMPORARY BONDING ADHESIVE COMPOSITIONS AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
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Assignees
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| 129, SAMSUNG-RO |
| YEONGTONG-GU, GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF |
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| 6-1, OHTEMACHI |
| 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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MYERS BIGEL SIBLEY & SAJOVEC
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PO BOX 37428
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RALEIGH, NC 27627
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