Patent Assignment Details
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| Reel/Frame: | 033391/0996 | |
| Pages: | 2 |
| | Recorded: | 07/25/2014 | | |
| Attorney Dkt #: | 8068-1092 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/16/2016
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Application #:
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14340850
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Filing Dt:
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07/25/2014
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Publication #:
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Pub Dt:
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01/29/2015
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Title:
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RESIN COMPOSITION FOR SOLDER BUMP FORMATION, SOLDER BUMP FORMATION METHOD, AND MEMBER HAVING SOLDER BUMPS
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Assignee
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| 31-16, HORIFUNE 1-CHOME, KITA-KU |
| TOKYO, JAPAN 114-0004 |
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Correspondence name and address
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YOUNG & THOMPSON
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209 MADISON STREET
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SUITE 500
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ALEXANDRIA, VA 22314
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