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Reel/Frame:033412/0751   Pages: 4
Recorded: 07/29/2014
Attorney Dkt #:3531.117959
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/10/2017
Application #:
14445608
Filing Dt:
07/29/2014
Publication #:
Pub Dt:
02/05/2015
Title:
LAMINATED WAFER PROCESSING METHOD
Assignors
1
Exec Dt:
07/14/2014
2
Exec Dt:
07/17/2014
3
Exec Dt:
07/17/2014
Assignee
1
13-11, OMORI-KITA 2-CHOME, OTA-KU
TOKYO, JAPAN 143-8580
Correspondence name and address
GREER, BURNS & CRAIN, LTD
300 S. WACKER DR.
SUITE 2500
CHICAGO, IL 60606

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