Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 033416/0631 | |
| Pages: | 5 |
| | Recorded: | 07/25/2014 | | |
| Attorney Dkt #: | MURATA-51219 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ERRONEOUS APPLICATION NO. 13/949,373 PREVIOUSLY RECORDED AT REEL: 031028 FRAME: 0331. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/28/2017
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Application #:
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13940373
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Filing Dt:
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07/12/2013
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Publication #:
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Pub Dt:
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11/14/2013
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Title:
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RESIN SEALED MODULE
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Assignee
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| 10-1, HIGASHIKOTARI 1-CHOME |
| NAGAOKAKYO-SHI |
| KYOTO, JAPAN 6178555 |
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Correspondence name and address
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PEARNE & GORDON, LLP
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1801 EAST 9TH STREET
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SUITE 1200
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CLEVELAND, OH 44114
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