Patent Assignment Details
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| Reel/Frame: | 033525/0626 | |
| Pages: | 2 |
| | Recorded: | 08/13/2014 | | |
| Attorney Dkt #: | 056204.66720US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/24/2015
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Application #:
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14374396
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Filing Dt:
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07/24/2014
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Publication #:
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Pub Dt:
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01/08/2015
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Title:
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Bonded Body and Semiconductor Module
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Assignee
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| 6-6, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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Correspondence name and address
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CROWELL & MORING, LLP
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1001 PENNSYLVANIA AVENUE, N.W.
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WASHINGTON, DC 20004
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