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Patent Assignment Details
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Reel/Frame:033538/0188   Pages: 13
Recorded: 08/14/2014
Attorney Dkt #:2008P06978US01, US02
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
09/03/2013
Application #:
13235984
Filing Dt:
09/19/2011
Publication #:
Pub Dt:
01/12/2012
Title:
WIRELESS TELEMETRY ELECTRONIC CIRCUIT BOARD FOR HIGH TEMPERATURE ENVIRONMENTS
2
Patent #:
Issue Dt:
06/11/2013
Application #:
13236083
Filing Dt:
09/19/2011
Publication #:
Pub Dt:
01/12/2012
Title:
METHOD FOR MANUFACTURING A CIRCUIT FOR HIGH TEMPERATURE AND HIGH G-FORCE ENVIRONMENTS
Assignors
1
Exec Dt:
08/07/2008
2
Exec Dt:
08/07/2008
3
Exec Dt:
08/07/2008
4
Exec Dt:
08/12/2008
5
Exec Dt:
08/07/2008
6
Exec Dt:
08/07/2008
7
Exec Dt:
08/07/2008
8
Exec Dt:
08/07/2008
9
Exec Dt:
08/07/2008
10
Exec Dt:
08/07/2008
Assignees
1
4400 ALAFAYA TRAIL
ORLANDO, FLORIDA 38286
2
535 W. RESEARCH CENTER BLVD., SUITE 209
FAYETTEVILLE, ARKANSAS 72701
Correspondence name and address
SIEMENS CORPORATION - IP DEPT.
170 WOOD AVENUE SOUTH
ISELIN, NJ 08830

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