Patent Assignment Details
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| Reel/Frame: | 033629/0657 | |
| Pages: | 6 |
| | Recorded: | 08/28/2014 | | |
| Attorney Dkt #: | Q211313 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/14/2016
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Application #:
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14471327
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Filing Dt:
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08/28/2014
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Publication #:
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Pub Dt:
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05/07/2015
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Title:
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APPARATUS AND METHOD OF ATTACHING SOLDER BALL AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING SOLDER BALL
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Assignee
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| 129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF 443-742 |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, DC 20037
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