Patent Assignment Details
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| Reel/Frame: | 033696/0363 | |
| Pages: | 8 |
| | Recorded: | 09/09/2014 | | |
| Attorney Dkt #: | FIS920130296US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14480718
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Filing Dt:
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09/09/2014
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Publication #:
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Pub Dt:
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03/10/2016
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Title:
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MUTIMETAL INTERLAYER INTERCONNECTS HAVING A PREDOMINENTLY TUNGSTEN LAYER EXTENDING BETWEEN TWO ELECTRICAL COMPONENTS
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORP-ROCHESTER DRAFTING CENTER
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2070 ROUTE 52
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HOPEWELL JUNCTION, NY 12533
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