Patent Assignment Details
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| Reel/Frame: | 033870/0473 | |
| Pages: | 7 |
| | Recorded: | 10/01/2014 | | |
| Attorney Dkt #: | 854263.604C2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13646249
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Filing Dt:
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10/05/2012
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Publication #:
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Pub Dt:
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01/31/2013
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Title:
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LID, FABRICATING METHOD THEREOF, AND MEMS PACKAGE MADE THEREBY
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Assignees
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| VIA C. OLIVETTI, 2 |
| AGRATE BRIANZA, ITALY 20864 |
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| NO. 38, HSING PONG RD., KWEI-SAN INDUSTRIAL ZONE |
| TAOYUAN, TAIWAN 333 |
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Correspondence name and address
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KAREN M. HENCKEL
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701 FIFTH AVENUE, SUITE 5400
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SEATTLE, WA 98104
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