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Reel/Frame:033994/0585   Pages: 6
Recorded: 10/21/2014
Attorney Dkt #:10829-9127.US00
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/05/2017
Application #:
14519753
Filing Dt:
10/21/2014
Publication #:
Pub Dt:
04/23/2015
Title:
SEMICONDUCTOR DEVICE INCLUDING TWO OR MORE CHIPS MOUNTED OVER WIRING SUBSTRATE
Assignors
1
Exec Dt:
10/21/2014
2
Exec Dt:
10/21/2014
3
Exec Dt:
10/21/2014
Assignee
1
8000 S. FEDERAL WAY, P.O. BOX 6
BOISE, IDAHO 83707-0006
Correspondence name and address
PERKINS COIE LLP - MICRON PATENT-SEA
PO BOX 1247
SEATTLE, WA 98111-1247

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