Patent Assignment Details
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| Reel/Frame: | 034010/0334 | |
| Pages: | 4 |
| | Recorded: | 10/16/2014 | | |
| Attorney Dkt #: | 0904-0164PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/25/2018
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Application #:
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14389565
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Filing Dt:
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09/30/2014
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Publication #:
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Pub Dt:
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04/02/2015
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Title:
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MULTIPLE SILICON TRENCHES FORMING METHOD FOR MEMS SEALING CAP WAFER AND ETCHING MASK STRUCTURE THEREOF
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Assignee
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| NO. 308 10 ROAD, EAST HETZ |
| HANGZHOU (XIASHA), CHINA 310018 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE ROAD, SUITE 100E
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FALLS CHURCH, VA 22042
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