Patent Assignment Details
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| Reel/Frame: | 034098/0205 | |
| Pages: | 3 |
| | Recorded: | 11/04/2014 | | |
| Attorney Dkt #: | 2014-1339A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/08/2015
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Application #:
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14391781
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Filing Dt:
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10/10/2014
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Publication #:
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Pub Dt:
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03/05/2015
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ADHESIVE FOR MOUNTING FLIP CHIP
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Assignee
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| 4-4, NISHITEMMA 2-CHOME, KITA-KU, OSAKA-SHI, |
| OSAKA, JAPAN 530-0047 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, LLP
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1030 15TH STREET, N.W.
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SUITE 400 EAST
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WASHINGTON, DC 20005
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