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Reel/Frame:034187/0577   Pages: 3
Recorded: 11/17/2014
Attorney Dkt #:5006.0005WU1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/08/2017
Application #:
14360906
Filing Dt:
11/18/2014
Publication #:
Pub Dt:
04/23/2015
Title:
ACTIVE CHIP PACKAGE SUBSTRATE AND METHOD FOR PREPARING THE SAME
Assignors
1
Exec Dt:
11/13/2014
2
Exec Dt:
11/13/2014
Assignee
1
NO.3 BEITUCHENG WEST ROAD, CHAOYANG DISTRICT
BEIJING, CHINA 100029
Correspondence name and address
JOHN P. FONDER
33 SOUTH SIXTH STREET
SUITE 3950
MINNEAPOLIS, MN 55402

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