Patent Assignment Details
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| Reel/Frame: | 034203/0802 | |
| Pages: | 3 |
| | Recorded: | 11/19/2014 | | |
| Attorney Dkt #: | 38456-US-1002-PCT-0P |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/25/2015
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Application #:
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14534169
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Filing Dt:
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11/06/2014
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Publication #:
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Pub Dt:
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03/05/2015
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Title:
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NEW ORGANOSILICON COMPOUND, THERMOSETTING RESIN COMPOSITION CONTAINING THE ORGANOSILICON COMPOUND, HARDENING RESIN AND ENCAPSULATION MATERIAL FOR OPTICAL SEMICONDUCTOR
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Assignee
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| 2-1, OTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8105 |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
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TAIPEI, 100 TAIWAN
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