Patent Assignment Details
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| Reel/Frame: | 034290/0686 | |
| Pages: | 2 |
| | Recorded: | 12/01/2014 | | |
| Attorney Dkt #: | DBH YGUC.3947 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/30/2017
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Application #:
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14475249
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Filing Dt:
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09/02/2014
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Publication #:
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Pub Dt:
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03/05/2015
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Title:
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Bump Electrode, Board Which Has Bump Electrodes, and Method for Manufacturing the Board
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Assignee
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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DONALD B. HASLETT, ESQ.
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601 SW SECOND AVENUE, SUITE 1600
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CHERNOFF VILHAUER MCCLUNG & STENZEL LLP
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PORTLAND, OR 97204-3157
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