Patent Assignment Details
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| Reel/Frame: | 034376/0690 | |
| Pages: | 6 |
| | Recorded: | 12/04/2014 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/02/2016
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Application #:
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14405532
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Filing Dt:
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12/04/2014
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Publication #:
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Pub Dt:
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05/28/2015
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Title:
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CHIP SCALE LIGHT EMITTING DEVICE WITH METAL PILLARS IN A MOLDING COMPOUND FORMED AT WAFER LEVEL
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Assignee
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| HIGH TECH CAMPUS |
| EINDHOVEN, NETHERLANDS 5656AE |
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Correspondence name and address
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PHILIPS INTELLECTUAL PROPERTY & STANDARD
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P.O. BOX 3001
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BRIARCLIFF MANOR, NY 10510
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