Patent Assignment Details
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| Reel/Frame: | 034467/0712 | |
| Pages: | 3 |
| | Recorded: | 12/10/2014 | | |
| Attorney Dkt #: | YGUC.3952 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/01/2018
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Application #:
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14407040
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Filing Dt:
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12/10/2014
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Publication #:
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Pub Dt:
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06/25/2015
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Title:
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Device for Coating Thin Molten Solder Film, Thin Solder Film-covered Component and Manufacturing Method Therefor
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Assignee
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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DONALD B. HASLETT
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601 SW SECOND AVENUE
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SUITE 1600
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PORTLAND, OR 97204-3157
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