Patent Assignment Details
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| Reel/Frame: | 034480/0328 | |
| Pages: | 3 |
| | Recorded: | 12/11/2014 | | |
| Attorney Dkt #: | 043814 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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06/30/2009
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Application #:
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11444447
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Filing Dt:
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06/01/2006
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Publication #:
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Pub Dt:
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04/12/2007
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Title:
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CONNECTING STRUCTURE, PRINTED SUBSTRATE, CIRCUIT, CIRCUIT PACKAGE AND METHOD OF FORMING CONNECTING STRUCTURE
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Patent #:
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Issue Dt:
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10/13/2009
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Application #:
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11485393
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Filing Dt:
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07/13/2006
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Publication #:
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Pub Dt:
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04/19/2007
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Title:
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LEAD PIN, CIRCUIT, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING LEAD PIN
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Patent #:
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Issue Dt:
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04/07/2009
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Application #:
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11699358
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Filing Dt:
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01/30/2007
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Publication #:
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Pub Dt:
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08/23/2007
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Title:
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SEMICONDUCTOR DEVICE
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Assignee
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| 2-6-1, KITAMIKATA |
| TAKATSU-KU, KAWASAKI-SHI |
| KANAGAWA, JAPAN 213-8511 |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVENUE NW
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SUITE 800
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WASHINGTON, DC 20037
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