Patent Assignment Details
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| Reel/Frame: | 034580/0070 | |
| Pages: | 3 |
| | Recorded: | 12/23/2014 | | |
| Attorney Dkt #: | 9023/0002PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/08/2017
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Application #:
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14581624
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Filing Dt:
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12/23/2014
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Publication #:
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Pub Dt:
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10/29/2015
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Title:
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METHOD FOR PRODUCING RESIN-ENCAPSULATED ELECTRONIC COMPONENT, BUMP-FORMED PLATE-LIKE MEMBER, RESIN-ENCAPSULATED ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING BUMP-FORMED PLATE-LIKE MEMBER
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Assignee
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| 5, KAMITOBA KAMICHOSHI-CHO, MINAMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 601-8105 |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, P.C.
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4000 LEGATO ROAD
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SUITE 310
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FAIRFAX, VA 22033
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