Patent Assignment Details
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| Reel/Frame: | 034604/0001 | |
| Pages: | 5 |
| | Recorded: | 12/30/2014 | | |
| Attorney Dkt #: | 2515.0396 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/22/2016
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Application #:
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13772683
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Filing Dt:
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02/21/2013
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Publication #:
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Pub Dt:
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09/05/2013
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Title:
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SEMICONDUCTOR DEVICE AND METHOD FOR FORMING A LOW PROFILE EMBEDDED WAFER LEVEL BALL GRID ARRAY MOLDED LASER PACKAGE (EWLB-MLP)
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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PATENT LAW GROUP: ATKINS AND ASSOCIATES
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55 N. ARIZONA PLACE
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SUITE 104
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CHANDLER, AZ 85225
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