Patent Assignment Details
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| Reel/Frame: | 034797/0708 | |
| Pages: | 2 |
| | Recorded: | 01/23/2015 | | |
| Attorney Dkt #: | 200105590D02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/05/2008
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Application #:
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10772345
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Filing Dt:
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02/06/2004
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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LEAD FRAME, RESIN SEALING MOLD AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
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Assignee
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| 2-5-5, KEIHANHONDORI |
| MORIGUCHI-CITY, OSAKA, JAPAN |
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Correspondence name and address
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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5005 E. MCDOWELL ROAD
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MD A700
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PHOENIX, AZ 85008
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