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Patent Assignment Details
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Reel/Frame:034798/0293   Pages: 4
Recorded: 01/23/2015
Attorney Dkt #:200202845D03 AND D04
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
01/31/2012
Application #:
10876532
Filing Dt:
06/28/2004
Publication #:
Pub Dt:
11/25/2004
Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH WIRING ON SIDE SURFACE THEREOF
2
Patent #:
Issue Dt:
09/18/2007
Application #:
11206146
Filing Dt:
08/18/2005
Publication #:
Pub Dt:
02/16/2006
Title:
SEMICONDUCTOR DEVICE WITH SIDEWALL WIRING
Assignors
1
Exec Dt:
07/25/2003
2
Exec Dt:
07/30/2003
3
Exec Dt:
07/28/2003
4
Exec Dt:
07/14/2003
5
Exec Dt:
07/28/2003
6
Exec Dt:
07/23/2003
7
Exec Dt:
07/24/2003
8
Exec Dt:
08/01/2003
Assignee
1
2-5-5, KEIHANHONDORI
MORIGUCHI-SHI, OSAKA, JAPAN 570-8677
Correspondence name and address
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD
MD A700
PHOENIX, AZ 85008

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