Patent Assignment Details
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Reel/Frame: | 034798/0293 | |
| Pages: | 4 |
| | Recorded: | 01/23/2015 | | |
Attorney Dkt #: | 200202845D03 AND D04 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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01/31/2012
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Application #:
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10876532
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Filing Dt:
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06/28/2004
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Publication #:
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Pub Dt:
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11/25/2004
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH WIRING ON SIDE SURFACE THEREOF
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Patent #:
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Issue Dt:
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09/18/2007
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Application #:
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11206146
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Filing Dt:
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08/18/2005
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Publication #:
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Pub Dt:
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02/16/2006
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Title:
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SEMICONDUCTOR DEVICE WITH SIDEWALL WIRING
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Assignee
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2-5-5, KEIHANHONDORI |
MORIGUCHI-SHI, OSAKA, JAPAN 570-8677 |
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Correspondence name and address
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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5005 E. MCDOWELL ROAD
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MD A700
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PHOENIX, AZ 85008
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