Patent Assignment Details
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| Reel/Frame: | 034825/0244 | |
| Pages: | 3 |
| | Recorded: | 01/27/2015 | | |
| Attorney Dkt #: | DBH YGUC.3955 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14606948
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Filing Dt:
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01/27/2015
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Publication #:
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Pub Dt:
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07/30/2015
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Title:
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Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT
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Assignee
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| SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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DONALD B. HASLETT, ESQ.
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601 SW SECOND AVENUE, SUITE 1600
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CHERNOFF VILHAUER MCCLUNG & STENZEL LLP
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PORTLAND, OR 97204
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