Patent Assignment Details
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| Reel/Frame: | 034848/0879 | |
| Pages: | 2 |
| | Recorded: | 01/29/2015 | | |
| Attorney Dkt #: | P647241-01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/13/2016
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Application #:
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14592576
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Filing Dt:
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01/08/2015
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Publication #:
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Pub Dt:
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04/30/2015
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Title:
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SEMICONDUCTOR DEVICE FOR USE IN FLIP-CHIP BONDING, WHICH REDUCES LATERAL DISPLACEMENT
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Assignee
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| 1-61, SHIROMI 2-CHOME, CHUO-KU, OSAKA-SHI |
| OSAKA, JAPAN 540-6207 |
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Correspondence name and address
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PANASONIC IP MANAGEMENT CO., LTD.
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7F OBP PANASONIC TOWER
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1-61, SHIROMI 2-CHOME, CHUO-KU
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OSAKA, 540-6207 JAPAN
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