Patent Assignment Details
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| Reel/Frame: | 034866/0258 | |
| Pages: | 4 |
| | Recorded: | 02/02/2015 | | |
| Attorney Dkt #: | 4593-444 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/07/2018
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Application #:
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14584223
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Filing Dt:
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12/29/2014
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Publication #:
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Pub Dt:
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06/30/2016
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Title:
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NOZZLE FOR CONNECTING OR DISCONNECTING SOLDER JOINTS BETWEEN HEAD BONDING PADS IN A HARD DISK DRIVE, AND LASER SOLDERING OR REFLOWING TOOL WITH THE SAME
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Assignee
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| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T. |
| HONG KONG, CHINA |
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Correspondence name and address
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NIXON & VANDERHYE, PC
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901 NORTH GLEBE ROAD, 11TH FLOOR
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ARLINGTON, VA 22203
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