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Reel/Frame:034997/0213   Pages: 3
Recorded: 02/20/2015
Attorney Dkt #:13TPY0779US01/851663.607
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
14586678
Filing Dt:
12/30/2014
Publication #:
Pub Dt:
06/30/2016
Title:
CORED SOLDER WIRE WITH ROSIN FLUX AND THERMOSET MATERIAL
Assignors
1
Exec Dt:
02/18/2015
2
Exec Dt:
02/18/2015
Assignee
1
28 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569508
Correspondence name and address
HAYLEY J. TALBERT
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104

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