Patent Assignment Details
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| Reel/Frame: | 035080/0428 | |
| Pages: | 4 |
| | Recorded: | 03/03/2015 | | |
| Attorney Dkt #: | 55445-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/09/2016
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Application #:
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14623517
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Filing Dt:
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02/17/2015
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Publication #:
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Pub Dt:
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08/18/2016
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Title:
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CHIP PACKAGE STRUCTURE HAVING A SHIELDED MOLDING COMPOUND
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Assignee
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| NO.26, DATONG RD., HUKOU TOWNSHIP, |
| HSINCHU COUNTY, TAIWAN 303 |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
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TAIPEI, TAIWAN
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