Patent Assignment Details
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| Reel/Frame: | 035140/0158 | |
| Pages: | 6 |
| | Recorded: | 03/11/2015 | | |
| Attorney Dkt #: | 33778U |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/12/2016
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Application #:
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14643684
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Filing Dt:
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03/10/2015
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Publication #:
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Pub Dt:
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09/24/2015
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Title:
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Method of Fabricating Semiconductor Device Including A Substrate Having Copper Interconnects
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Assignee
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| AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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Correspondence name and address
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NATH, GOLDBERG & MEYER
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112 S WEST STREET
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33778U_JLM_HP
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ALEXANDRIA, VA 22314
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