Patent Assignment Details
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Reel/Frame: | 035186/0951 | |
| Pages: | 12 |
| | Recorded: | 03/12/2015 | | |
Attorney Dkt #: | 243275.000009 |
Conveyance: | CHANGE OF ADDRESS |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/05/2015
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Application #:
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13508864
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Filing Dt:
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05/09/2012
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Publication #:
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Pub Dt:
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09/06/2012
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Title:
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SOLDER BALL FOR SEMICONDUCTOR PACKAGING AND ELECTRONIC MEMBER USING THE SAME
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Assignee
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16-3, GINZA 7-CHOME, CHUO-KU |
TOKYO, JAPAN 1040061 |
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Correspondence name and address
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TROUTMAN SANDERS LLP
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405 LEXINGTON AVENUE, CHRYSLER BUILDING
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NEW YORK, NY 10174-0700
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